Integration and packaging of 5G and millimeter wave compact radio modules
Traditionally millimeter wave technologies have been related mainly to infrastructure, space and military applications with rather small number of products. Recent developments in automotive and telecom markets have pushed especially silicon and packaging technologies towards consumer applications.
Need for low cost millimeter wave products require mass production suitable technologies. In addition to cost, small and light weight properties are needed from consumer products. This presentation focuses to millimeter wave integration, packaging and circuit technologies suitable for consumer type products.