Silica-Based Packaging Structure for D-Band RF Module

This paper presents a packaging structure in D-band, which is a stacked structure of a silica-based substrate, a print wiring board, and a metal chassis. Key structures, which are transition structures in RF transmission paths and band-pass filters, are designed. The fabricated transitions show good frequency responses due to silica with excellent electrical characteristics. The fabricated three-resonator filters show small deviations in frequency responses among samples along with good filter performances.